The Robustness of Various Test Compression Techniques

Larger designs and the growing population of non-stuck defects have led many companies to adopt test compression techniques. In fact, the Embedded Deterministic Test (EDT) technology within TessentTM TestKompress® has now been used in over one billion production chips. There has been a surge of compression techniques promoted in the industry since Tessent TestKompress was released in 2001. So, why has Tessent TestKompress become the standard approach in industry? This paper will explain the technology behind the various compression techniques and their robustness in the presence of Xs, false and multicycle paths, low pin access, and other design factors. Silicon Test & Yield Analysis Whitepaper The Robustness of Various Test Compression Techniques 29353 Page ii Table of